Исследование MOSFET-транзисторов в различных герметичных корпусах для поверхностного монтажа
The assembly processes of MOSFET transistors in the SMD-1 metal-ceramic package were investigated in comparison with the SMD-220 metal-plastic package. Results regarding electrical and thermal parameters are presented. It is shown that the “p-n junction–package” thermal resistance is higher for SMD-...
Збережено в:
| Дата: | 2004 |
|---|---|
| Автори: | , , |
| Формат: | Стаття |
| Мова: | Українська |
| Опубліковано: |
PE "Politekhperiodika", Book and Journal Publishers
2004
|
| Теми: | |
| Онлайн доступ: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.5.54 |
| Теги: |
Додати тег
Немає тегів, Будьте першим, хто поставить тег для цього запису!
|
| Назва журналу: | Technology and design in electronic equipment |
Репозитарії
Technology and design in electronic equipment| Резюме: | The assembly processes of MOSFET transistors in the SMD-1 metal-ceramic package were investigated in comparison with the SMD-220 metal-plastic package. Results regarding electrical and thermal parameters are presented. It is shown that the “p-n junction–package” thermal resistance is higher for SMD-1; however, the thermal conductivity consistency of the SMD-1 package components allows for the manufacture of devices with minimal internal stresses and ensures their high hermeticity and reliability under conditions of temperature fluctuations exceeding 300°C. |
|---|