Исследование MOSFET-транзисторов в различных герметичных корпусах для поверхностного монтажа

• Date: 2004
• Main Authors: Rubtsevitch, I. I., Anufriev, L. P., Kerentsev, A. F.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2004
• Subjects: MOSFET-транзистор; металлокерамический корпус; поверхностный монтаж; герметичность корпуса; тепловое сопротивление транзистора
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.5.54
• Journal Title: Technology and design in electronic equipment

The assembly processes of MOSFET transistors in the SMD-1 metal-ceramic package were investigated in comparison with the SMD-220 metal-plastic package. Results regarding electrical and thermal parameters are presented. It is shown that the “p-n junction–package” thermal resistance is higher for SMD-...