Метод компоновки плат микросборки
A method of layout design for microassembly boards is presented, characterized by high packing density and minimal manufacturing cost. The proposed method allows substantiating the choice of board material, taking into account the specific features of microassembly components and ensuring their ther...
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| Datum: | 2004 |
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| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2004
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.1.11 |
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| Назва журналу: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Zusammenfassung: | A method of layout design for microassembly boards is presented, characterized by high packing density and minimal manufacturing cost. The proposed method allows substantiating the choice of board material, taking into account the specific features of microassembly components and ensuring their thermal operating conditions. The dimensions of the thin-film board should be selected so that the developed photomask multiplication scheme occupies at least 75–85% of the substrate area and does not extend beyond its technological fields. |
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