Метод компоновки плат микросборки
A method of layout design for microassembly boards is presented, characterized by high packing density and minimal manufacturing cost. The proposed method allows substantiating the choice of board material, taking into account the specific features of microassembly components and ensuring their ther...
Saved in:
| Date: | 2004 |
|---|---|
| Keywords: | keywords |
| Main Author: | |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2004
|
| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2004.1.11 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Journal Title: | Technology and design in electronic equipment |
Institution
Technology and design in electronic equipment| Summary: | A method of layout design for microassembly boards is presented, characterized by high packing density and minimal manufacturing cost. The proposed method allows substantiating the choice of board material, taking into account the specific features of microassembly components and ensuring their thermal operating conditions. The dimensions of the thin-film board should be selected so that the developed photomask multiplication scheme occupies at least 75–85% of the substrate area and does not extend beyond its technological fields. |
|---|