Влияние кремниевой подложки на пробивное напряжение разветвленного n++–p+-перехода

• Date: 2003
• Main Authors: Sidorenko, V. P., Kizyak, A. Yu., Nikolaenko, Yu. E.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2003
• Subjects: кремниевая подложка; пробивное напряжение; n –p переход; микродефекты; кислород; углерод; СБИС
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2003.6.56
• Journal Title: Technology and design in electronic equipment

The paper examines the influence of microdefects, as well as oxygen and carbon impurities in the silicon substrate, on the breakdown voltage of an uncontrolled n++–p+ junction. The mechanism of oxygen impurity impact on the type of breakdown is briefly discussed. Practical applications of the result...