Механизм регулярных формоизменений микропроволоки при воздействии токовых нагрузок

A mechanism is proposed for the formation of micro- and macrorelief and the structure of calibrated copper microwire under the influence of electric current pulses. The strict (as a rule) periodicity of microwire shape changes is interpreted from the standpoint of synergetics of a deformable solid b...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Datum:2003
Hauptverfasser: Moiseev, L. M., Kovalchuk, V. V.
Format: Artikel
Sprache:Ukrainisch
Veröffentlicht: PE "Politekhperiodika", Book and Journal Publishers 2003
Schlagworte:
Online Zugang:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2003.5.53
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Назва журналу:Technology and design in electronic equipment

Institution

Technology and design in electronic equipment