Установка толстослойного анодирования алюминия
To improve the efficiency of plate cooling during the production of bases from anodized aluminum, it is proposed to carry out the process of thick‑layer anodizing under continuous plate movement. Based on this principle, a dynamic anodizing installation was developed, enabling the formation of oxide...
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| Datum: | 2003 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2003
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2003.2.40 |
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| Назва журналу: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Zusammenfassung: | To improve the efficiency of plate cooling during the production of bases from anodized aluminum, it is proposed to carry out the process of thick‑layer anodizing under continuous plate movement. Based on this principle, a dynamic anodizing installation was developed, enabling the formation of oxide layers up to 0.4 mm thick on bases ranging from 48×60 mm to 100×100 mm, as well as substrates of free anodic oxide up to 1 mm thick. The resulting layers exhibit high physical and mechanical properties without oxide loosening. |
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