Поверхностный монтаж электронных компонентов: особенности использования
The expediency of phased implementation of surface‑mount technology (SMT) in existing and revitalized electronic equipment production facilities in Ukraine is demonstrated. Characteristics of the available technological equipment are provided, along with recommendations for its use depending on prod...
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| Datum: | 2003 |
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| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2003
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2003.1.05 |
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| Назва журналу: | Technology and design in electronic equipment |
| Завантажити файл: |  |