Использование керамики на основе твердых растворов (Ni, Co, Mn, Cu)3O4 для толстопленочных терморезисторов

• Published in: Технологія та конструювання в електронній апаратурі
• Date: 2002
• Issue: 4–5
• Pages: 55-57
• ISSN: 3083-6549
• Author Affiliations: O. I. Shpotyuk — SPA «Karat», Lviv, Ukraine; I. V. Hadzaman — НПП «Карат», Львов, Украина; R. V. Okhrymovych — SPA «Karat», Lviv, Ukraine; M. M. Vakiv — SPA «Karat», Lviv, Ukraine; S. I. Osechkin — SPA «Karat», Lviv, Ukraine; V. M. Tsmots — Drohobych State Pedagogical University named after Ivan Franko, Ukraine; I. M. Brunets — SPA «Karat», Lviv, Ukraine
• Main Authors: Shpotyuk, O. I., Hadzaman, I. V., Okhrymovych, R. V., Vakiv, M. M., Osechkin, S. I., Tsmots, V. M., Brunets, I. M.
• Format: Article
• Language: yo
• Published: PE "Politekhperiodika", Book and Journal Publishers 2002
• Subjects: керамика на основе твердых растворов; толстопленочные терморезисторы; полупроводниковая шпинельная керамика; Co-обогащенный состав; тепловая постоянная; фазовый состав; электрические свойства; морфология структуры
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2002.4-5.55
• Journal Title: Technology and design in electronic equipment

Using the example of the Co-enriched composition Cu₀.₁Ni₀.₁Mn₁.₂Co₁.₆O₄, the possibility of using semiconductor spinel ceramics of the NiMn₂O₄–CuMn₂O₄–MnCo₂O₄ system for obtaining highly stable thick-film thermistors with a high thermal time constant value is demonstrated. The technological process for obtaining thick films has been developed, and their phase composition, electrical properties, and stability have been studied. The obtained films are characterized by good structural morphology and high density. The effect of layer thickness on the stability of electrical parameters has been investigated.