CFD-моделювання імпактно-струменевого радіатора для проведення термотренування мікропроцесорів
One of the final stages of microprocessor development is thermal testing. This procedure is performed on a special stand, the main element of which is a switching PCB with mounted microprocessor sockets, chipsets, interfaces, jumpers and other components which provide various modes of microprocessor...
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| Date: | 2018 |
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| Main Authors: | , , |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2018
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2018.5-6.30 |
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| Journal Title: | Technology and design in electronic equipment |