Герметизація пайкою корпусів мікроблоків з діамагнітних сплавів з використанням високочастотного нагріву
The main difficulties of application of high-frequency (HF) heating for sealing by soldering of microblock packages made of aluminum alloys is the low efficiency of heating, long processing time and considerable heating of the internal electronic module while sealing.The purpose of this study was to...
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| Date: | 2018 |
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| Main Authors: | , |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2018
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2018.3.03 |
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| Journal Title: | Technology and design in electronic equipment |