Варіанти технології вбудовування низькопрофільної електроніки в друковані плати
In order to improve the overall characteristics of printed circuit boards, two technologies for the formation of multilayer printed circuit boards have been developed - with the embedding of low-profile electronic components in a layer of fiberglass and a monolithic layer of polyimide, provided that...
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| Datum: | 2018 |
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| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | English |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2018
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2018.1.03 |
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| Назва журналу: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Zusammenfassung: | In order to improve the overall characteristics of printed circuit boards, two technologies for the formation of multilayer printed circuit boards have been developed - with the embedding of low-profile electronic components in a layer of fiberglass and a monolithic layer of polyimide, provided that they are assembled without soldering and welding. The indicators for quantitative evaluation of printed circuit boards with embedded electronic components and their comparison both among themselves and with printed circuit boards without embedded electronic components are proposed. |
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