Варіанти технології вбудовування низькопрофільної електроніки в друковані плати
In order to improve the overall characteristics of printed circuit boards, two technologies for the formation of multilayer printed circuit boards have been developed - with the embedding of low-profile electronic components in a layer of fiberglass and a monolithic layer of polyimide, provided that...
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| Date: | 2018 |
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| Main Authors: | , |
| Format: | Article |
| Language: | English |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2018
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2018.1.03 |
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| Journal Title: | Technology and design in electronic equipment |