Моделі друкованих плат для непаяного монтажу електронних компонентів методом проколу фольги
The paper presents models of printed circuit boards for an improved foil perforation method. The density of electrical connections of such printed circuit boards is estimated in comparison with circuit boards obtained using the methods of mounting in holes and surface mounting. The technological dif...
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| Date: | 2017 |
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| Main Authors: | , |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2017
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2017.4-5.03 |
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| Journal Title: | Technology and design in electronic equipment |