Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами
In the article, design and technological features of multiprobe connecting device for testing the electronic components with matrix ball leads are described and substantiated. Such test fixture has probes made as two separated flatcontact lands that can be used for testing BGA/CSP components or micr...
Gespeichert in:
| Datum: | 2016 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2016
|
| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.2-3.15 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Назва журналу: | Technology and design in electronic equipment |
Institution
Technology and design in electronic equipment| id |
oai:tkea.com.ua:article-241 |
|---|---|
| record_format |
ojs |
| spelling |
oai:tkea.com.ua:article-2412025-05-30T19:31:28Z Design of multiprobe devices for electronic components with ball leads testing Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами Nevlyudov, I. Sh. Palagin, V. A. Razumov-Frizyuk, E. A. Zharikova, I. V. electronic components BGA multiprobe connecting device testing contacting flexible PCB polyimide электронные компоненты BGA многозондовое подключающее устройство тестирование контактирование гибкий шлейф полиимид фольгированный In the article, design and technological features of multiprobe connecting device for testing the electronic components with matrix ball leads are described and substantiated. Such test fixture has probes made as two separated flatcontact lands that can be used for testing BGA/CSP components or microelectromechanical devices. Only in case, when two parts of probe contact lands are pressed to according lead of electronic component, electrical circuit between them closes. This fact confirms presence of contact between testing fixture probe and tested lead of BGA device and can be considered as way of testing reliability increasing. Due to the proposed new form of contact probe for electronic component testing, it became possible to simplify the topology of connecting circuit board.Developed commutative board with ZIF connectors allows realizing multiprobe device connection to automated measuring systems, providing also the possibility of its future application to test other electronic components with more leads. Also, the results of experimental and modeling research of developed device prototype are presented and explained. Obtained results substantiate the basic requirements for the multiprobe connecting device that should be observed during its contacting to the unit under test.Designed test fixture is more simple and cheap in comparison with its analogues. Also, the developed method of testing effectively provides the necessary contact pressure between test fixture and unit under test without hazard of its deformation, which can appear in similar devices. В продолжение работ авторов по проектированию многозондового подключающего устройства для контроля изделий с матричными шариковыми выводами, представлены новые результаты исследований опытного образца устройства. Предложено изменить форму зонда для снижения трудоемкости проектирования МПУ. Разработана коммутационная плата с ZIP-разъемами для подключения МПУ к автоматизированному измерительному устройству. PE "Politekhperiodika", Book and Journal Publishers 2016-06-29 Article Article Peer-reviewed Article application/pdf https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.2-3.15 10.15222/TKEA2016.2-3.15 Technology and design in electronic equipment; No. 2–3 (2016): Tekhnologiya i konstruirovanie v elektronnoi apparature; 15-20 Технологія та конструювання в електронній апаратурі; № 2–3 (2016): Технология и конструирование в электронной аппаратуре; 15-20 3083-6549 3083-6530 uk https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.2-3.15/209 Copyright (c) 2016 I. Sh. Nevlyudov, V. A. Palagin, E. A. Razumov-Frizyuk, I. V. Zharikova http://creativecommons.org/licenses/by/4.0/ |
| institution |
Technology and design in electronic equipment |
| baseUrl_str |
|
| datestamp_date |
2025-05-30T19:31:28Z |
| collection |
OJS |
| language |
Ukrainian |
| topic |
электронные компоненты BGA многозондовое подключающее устройство тестирование контактирование гибкий шлейф полиимид фольгированный |
| spellingShingle |
электронные компоненты BGA многозондовое подключающее устройство тестирование контактирование гибкий шлейф полиимид фольгированный Nevlyudov, I. Sh. Palagin, V. A. Razumov-Frizyuk, E. A. Zharikova, I. V. Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами |
| topic_facet |
electronic components BGA multiprobe connecting device testing contacting flexible PCB polyimide электронные компоненты BGA многозондовое подключающее устройство тестирование контактирование гибкий шлейф полиимид фольгированный |
| format |
Article |
| author |
Nevlyudov, I. Sh. Palagin, V. A. Razumov-Frizyuk, E. A. Zharikova, I. V. |
| author_facet |
Nevlyudov, I. Sh. Palagin, V. A. Razumov-Frizyuk, E. A. Zharikova, I. V. |
| author_sort |
Nevlyudov, I. Sh. |
| title |
Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами |
| title_short |
Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами |
| title_full |
Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами |
| title_fullStr |
Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами |
| title_full_unstemmed |
Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами |
| title_sort |
проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами |
| title_alt |
Design of multiprobe devices for electronic components with ball leads testing |
| description |
In the article, design and technological features of multiprobe connecting device for testing the electronic components with matrix ball leads are described and substantiated. Such test fixture has probes made as two separated flatcontact lands that can be used for testing BGA/CSP components or microelectromechanical devices. Only in case, when two parts of probe contact lands are pressed to according lead of electronic component, electrical circuit between them closes. This fact confirms presence of contact between testing fixture probe and tested lead of BGA device and can be considered as way of testing reliability increasing. Due to the proposed new form of contact probe for electronic component testing, it became possible to simplify the topology of connecting circuit board.Developed commutative board with ZIF connectors allows realizing multiprobe device connection to automated measuring systems, providing also the possibility of its future application to test other electronic components with more leads. Also, the results of experimental and modeling research of developed device prototype are presented and explained. Obtained results substantiate the basic requirements for the multiprobe connecting device that should be observed during its contacting to the unit under test.Designed test fixture is more simple and cheap in comparison with its analogues. Also, the developed method of testing effectively provides the necessary contact pressure between test fixture and unit under test without hazard of its deformation, which can appear in similar devices. |
| publisher |
PE "Politekhperiodika", Book and Journal Publishers |
| publishDate |
2016 |
| url |
https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.2-3.15 |
| work_keys_str_mv |
AT nevlyudovish designofmultiprobedevicesforelectroniccomponentswithballleadstesting AT palaginva designofmultiprobedevicesforelectroniccomponentswithballleadstesting AT razumovfrizyukea designofmultiprobedevicesforelectroniccomponentswithballleadstesting AT zharikovaiv designofmultiprobedevicesforelectroniccomponentswithballleadstesting AT nevlyudovish proektirovaniemnogozondovyhustrojstvdlâtestirovaniâélektronnyhkomponentovsšarikovymivyvodami AT palaginva proektirovaniemnogozondovyhustrojstvdlâtestirovaniâélektronnyhkomponentovsšarikovymivyvodami AT razumovfrizyukea proektirovaniemnogozondovyhustrojstvdlâtestirovaniâélektronnyhkomponentovsšarikovymivyvodami AT zharikovaiv proektirovaniemnogozondovyhustrojstvdlâtestirovaniâélektronnyhkomponentovsšarikovymivyvodami |
| first_indexed |
2025-09-24T17:30:35Z |
| last_indexed |
2025-09-24T17:30:35Z |
| _version_ |
1850410227564806144 |