Проектирование многозондовых устройств для тестирования электронных компонентов с шариковыми выводами

• Date: 2016
• Main Authors: Nevlyudov, I. Sh., Palagin, V. A., Razumov-Frizyuk, E. A., Zharikova, I. V.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2016
• Subjects: электронные компоненты; BGA; многозондовое подключающее устройство; тестирование; контактирование; гибкий шлейф; полиимид фольгированный
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2016.2-3.15
• Journal Title: Technology and design in electronic equipment

In the article, design and technological features of multiprobe connecting device for testing the electronic components with matrix ball leads are described and substantiated. Such test fixture has probes made as two separated flatcontact lands that can be used for testing BGA/CSP components or micr...