Формирование нанопленок Cu, Ag, Au под воздействием атомов водорода

• Date: 2015
• Main Authors: Zhavzharov, E. L., Matyushin, V. M.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2015
• Subjects: нанопленки Ag; Cu; Au; атомарный водород; рекомбинация; распыление
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2015.5-6.41
• Journal Title: Technology and design in electronic equipment

Due to their electrical properties, thin metallic films are widely used in modern micro- and nanoelectronics. These properties allow solving fundamental problems of surface and solid state physics. Up-to-date methods of producing thin films involve high vacuum or multi-stage processes, which calls f...