Оптимизация расположения межслойных переходов на группе проводников

Most PCB design CAD systems offer a limited number of “patterns” for the via placement on a bus (group of wires) which would be either a single- or a double-row placement. This article demonstrates the incorrectness of such limitations, because in this case the mounting space is used not in an optim...

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Bibliographische Detailangaben
Datum:2015
Hauptverfasser: Knop, K. A., Luzin, S. Yu.
Format: Artikel
Sprache:Ukrainian
Veröffentlicht: PE "Politekhperiodika", Book and Journal Publishers 2015
Schlagworte:
Online Zugang:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2015.2-3.10
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Назва журналу:Technology and design in electronic equipment

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Technology and design in electronic equipment