Микросборка на кремниевой плате для акселерометра
The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces.
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| Datum: | 2013 |
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| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2013
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2023.5.24 |
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| Назва журналу: | Technology and design in electronic equipment |
Institution
Technology and design in electronic equipment| Zusammenfassung: | The paper presents microassembly design and technology for accelerometer, carried out on a silicon plate with three commutation levels and thin film resistors on both of its surfaces. |
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