Сравнительный анализ методов сборки микросхем на гибких полиимидных носителях
The article presents a classification of methods for the microcircuit assembly with the use of flexible polyimide carriers of different types, and their comparative analysis. The most appropriate method for the manufacturing of flexible dual-layer carriers is singled out.
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| Datum: | 2013 |
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| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2013
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2013.5.37 |
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| Назва журналу: | Technology and design in electronic equipment |