Cover Image

Устройства для контроля качества сварных соединений выводов бескорпусных микросхем

The author considers the design and operation of two devices for quality control of welded joints between aluminium leads of packageless microcircuits and contact pads of a thin-film circuit.

Saved in:
Bibliographic Details
Date:2013
Main Author: Spirin, V. G.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2013
Subjects:
микросборка
контроль качества
сваркa выводов микросхем
Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2013.4.42
Tags: Add Tag
No Tags, Be the first to tag this record!
Journal Title:Technology and design in electronic equipment

Institution

Technology and design in electronic equipment

Similar Items

Similar Items