Устройства для контроля качества сварных соединений выводов бескорпусных микросхем
The author considers the design and operation of two devices for quality control of welded joints between aluminium leads of packageless microcircuits and contact pads of a thin-film circuit.
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| Date: | 2013 |
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| Main Author: | |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2013
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2013.4.42 |
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| Journal Title: | Technology and design in electronic equipment |