Многоуровневые платы с толстопленочной полимерной изоляцией
Three design and technological versions of multilayer circuit have been developed. The interlayer and protective isolation in these circuits was performed with thick (10–30 micron) heat-resistant photosensitive organic dielectric film. Such performance allows attaching component leads to the contact...
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| Datum: | 2012 |
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| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2012
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2012.5.03 |
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| Назва журналу: | Technology and design in electronic equipment |