Многоуровневые платы с толстопленочной полимерной изоляцией

• Datum: 2012
• 1. Verfasser: Spirin, V. G.
• Format: Artikel
• Sprache: Ukrainisch
• Veröffentlicht: PE "Politekhperiodika", Book and Journal Publishers 2012
• Schlagworte: микросборка; многоуровневая плата; толстопленочная полимерная изоляция
• Online Zugang: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2012.5.03
• Назва журналу: Technology and design in electronic equipment

Three design and technological versions of multilayer circuit have been developed. The interlayer and protective isolation in these circuits was performed with thick (10–30 micron) heat-resistant photosensitive organic dielectric film. Such performance allows attaching component leads to the contact...