Подключающее МЭМС-устройство для контроля BGA-компонентов
Multiprobe сonnecting device for initial and functional check of electronic components with matrix pin balls has been developed. The device ensures nondefect pneumatic pressing of probes against the terminals.
Gespeichert in:
| Datum: | 2012 |
|---|---|
| Hauptverfasser: | , , , , , , , |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2012
|
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/475 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Назва журналу: | Technology and design in electronic equipment |
Institution
Technology and design in electronic equipment| Zusammenfassung: | Multiprobe сonnecting device for initial and functional check of electronic components with matrix pin balls has been developed. The device ensures nondefect pneumatic pressing of probes against the terminals. |
|---|