Подключающее МЭМС-устройство для контроля BGA-компонентов
Multiprobe сonnecting device for initial and functional check of electronic components with matrix pin balls has been developed. The device ensures nondefect pneumatic pressing of probes against the terminals.
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| Datum: | 2012 |
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| Hauptverfasser: | , , , , , , , |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2012
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| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/475 |
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| Назва журналу: | Technology and design in electronic equipment |