Применение технологии тонких пленок и наноструктурированных материалов при изготовлении теплонагруженных печатных плат
The expediency is shown for application of aluminium nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board. There was described the technology of printed circuit board with resistors, located in the vias, based on the use of a metal base...
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| Datum: | 2011 |
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| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | Ukrainian |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2011
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2011.5.03 |
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| Назва журналу: | Technology and design in electronic equipment |