Применение технологии тонких пленок и наноструктурированных материалов при изготовлении теплонагруженных печатных плат

• Date: 2011
• Main Authors: Sakhno, E. A., Balashov, M. A., Zhilikov, V. V., Lobasov, D. V.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2011
• Subjects: печатная плата; металлическое основание; теплопроводность; нитрид алюминия
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2011.5.03
• Journal Title: Technology and design in electronic equipment

The expediency is shown for application of aluminium nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board. There was described the technology of printed circuit board with resistors, located in the vias, based on the use of a metal base...