Роль пластической деформации в получении нанокремния

The quantity and quality analysis of plastic deformation and near-surface silicon layers with nanostructure silicon formation are given in this paper. It is shown, due to high-temperature oxidation and other factors the complex defect structure is generated in near-surface silicon layers. It consist...

Повний опис

Збережено в:
Бібліографічні деталі
Дата:2011
Автори: Smyntyna, V. A., Kulinich, O. A., Yatsunkiy, I. R., Marchuk, I. A.
Формат: Стаття
Мова:Ukrainian
Опубліковано: PE "Politekhperiodika", Book and Journal Publishers 2011
Теми:
Онлайн доступ:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2011.1-2.22
Теги: Додати тег
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Назва журналу:Technology and design in electronic equipment

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Technology and design in electronic equipment
Опис
Резюме:The quantity and quality analysis of plastic deformation and near-surface silicon layers with nanostructure silicon formation are given in this paper. It is shown, due to high-temperature oxidation and other factors the complex defect structure is generated in near-surface silicon layers. It consists of a disordered silicon layer and a layer of dislocation networks. Silicon dioxide etching and additional chemical treatment allows obtaining nanostructured silicon with given properties.