Вли­я­ние об­лу­че­ния кре­м­ния ни­з­ко­энер­ге­ти­че­ски­ми ио­на­ми ар­го­на на об­ра­зо­ва­ние в нем элек­три­че­ски ак­тив­ных де­фек­тов

The article displays the results of investigation of influence of low energy (3—6 keV) argon ion etching of p-type silicon on electrically active defects (EAD) formation. The photosensitivity of Schottky diodes on etched silicon surface is increased, reaching maximum values in sites of EAD. The etch...

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Bibliographische Detailangaben
Datum:2009
Hauptverfasser: Popov, V. M., Shustov, Yu. M., Klimenko, A. S., Pokanevich, A. P.
Format: Artikel
Sprache:Ukrainian
Veröffentlicht: PE "Politekhperiodika", Book and Journal Publishers 2009
Schlagworte:
Online Zugang:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2009.4.48
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Назва журналу:Technology and design in electronic equipment

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Technology and design in electronic equipment