Исследование процессов теплообмена в коллекторных термосифонах коммутационных плат высокой степени интеграции
The processes of heat transfer and fluid dynamics of the coolant in the channels of a collector thermosyphon integrated into a heat-loaded switching board have been investigated. The most rational geometry of evaporator channels has been determined. Experimental dependencies of the surface temperat...
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| Date: | 2007 |
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| Main Authors: | , |
| Format: | Article |
| Language: | Ukrainian |
| Published: |
PE "Politekhperiodika", Book and Journal Publishers
2007
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| Subjects: | |
| Online Access: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2007.6.36 |
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| Journal Title: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Summary: | The processes of heat transfer and fluid dynamics of the coolant in the channels of a collector thermosyphon integrated into a heat-loaded switching board have been investigated. The most rational geometry of evaporator channels has been determined. Experimental dependencies of the surface temperature of switching boards on the applied heat flux have been obtained. It is shown that embedding collector thermosyphons with slot channels into switching boards makes it possible to reduce the temperature in the heat input zone by a factor of two.
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