Исследование процессов теплообмена в коллекторных термосифонах коммутационных плат высокой степени интеграции

• Date: 2007
• Main Authors: Nikolaenko, Yu. Ye., Tsyganskiy, А. А.
• Format: Article
• Language: Ukrainian
• Published: PE "Politekhperiodika", Book and Journal Publishers 2007
• Subjects: коммутационная плата; коллекторный термосифон; тепловой режим; охлаждение аппаратуры
• Online Access: https://www.tkea.com.ua/index.php/journal/article/view/TKEA2007.6.36
• Journal Title: Technology and design in electronic equipment

The processes of heat transfer and fluid dynamics of the coolant in the channels of a collector thermosyphon integrated into a heat-loaded switching board have been investigated. The most rational geometry of evaporator channels has been determined. Experimental dependencies of the surface temperat...