Применение бессвинцового стекла в толстопленочных терморезистивных материалах
The technological features of preparation and the electrical characteristics of thick‑film compositions based on semiconductor ceramics and lead‑free glass for thermistors with a negative temperature coefficient of resistance are analyzed. The obtained environmentally safe thick‑film materials provi...
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| Datum: | 2007 |
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| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2007
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| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2007.2.52 |
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| Назва журналу: | Technology and design in electronic equipment |
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Technology and design in electronic equipment| Zusammenfassung: | The technological features of preparation and the electrical characteristics of thick‑film compositions based on semiconductor ceramics and lead‑free glass for thermistors with a negative temperature coefficient of resistance are analyzed. The obtained environmentally safe thick‑film materials provide the thermosensitivity and stability required for microelectronic temperature sensors. |
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