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Поверхностный монтаж мощных бескорпусных MOSFET-транзисторов

The processes of mounting MOSFET transistor chips onto metallic and ceramic die holders intended for surface mounting have been investigated. The quality of chip attachment was evaluated using optical inspection, non-destructive X-ray television diagnostics, photoacoustic testing, and laser microint...

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Bibliographische Detailangaben
Datum:2006
Hauptverfasser: Anufriev, D. L., Rubtsevich, I. I., Kerentsev, A. F.
Format: Artikel
Sprache:Ukrainisch
Veröffentlicht: PE "Politekhperiodika", Book and Journal Publishers 2006
Schlagworte:
поверхностный монтаж
бескорпусный MOSFET-транзистор
золото-кремниевая эвтектика
кристаллодержатель
вибрационная пайка
Online Zugang:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.2.45
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Назва журналу:Technology and design in electronic equipment

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Technology and design in electronic equipment
Beschreibung
Zusammenfassung:The processes of mounting MOSFET transistor chips onto metallic and ceramic die holders intended for surface mounting have been investigated. The quality of chip attachment was evaluated using optical inspection, non-destructive X-ray television diagnostics, photoacoustic testing, and laser microinterferometry. Results on electrical and thermal parameters are presented. It was established that mounting chips on Au–Si eutectic significantly increases the stability of the thermal parameters of high-power transistors under cyclic temperature changes.

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