Поверхностный монтаж мощных бескорпусных MOSFET-транзисторов
The processes of mounting MOSFET transistor chips onto metallic and ceramic die holders intended for surface mounting have been investigated. The quality of chip attachment was evaluated using optical inspection, non-destructive X-ray television diagnostics, photoacoustic testing, and laser microint...
Gespeichert in:
| Datum: | 2006 |
|---|---|
| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | Ukrainisch |
| Veröffentlicht: |
PE "Politekhperiodika", Book and Journal Publishers
2006
|
| Schlagworte: | |
| Online Zugang: | https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.2.45 |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Назва журналу: | Technology and design in electronic equipment |
Institution
Technology and design in electronic equipmentSchreiben Sie den ersten Kommentar!