Поверхностный монтаж мощных бескорпусных MOSFET-транзисторов

The processes of mounting MOSFET transistor chips onto metallic and ceramic die holders intended for surface mounting have been investigated. The quality of chip attachment was evaluated using optical inspection, non-destructive X-ray television diagnostics, photoacoustic testing, and laser microint...

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Bibliographic Details
Date:2006
Main Authors: Anufriev, D. L., Rubtsevich, I. I., Kerentsev, A. F.
Format: Article
Language:Ukrainian
Published: PE "Politekhperiodika", Book and Journal Publishers 2006
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Online Access:https://www.tkea.com.ua/index.php/journal/article/view/TKEA2006.2.45
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Journal Title:Technology and design in electronic equipment

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Technology and design in electronic equipment