Thermal simulation of heterogeneous structural components in microelectronic devices

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Bibliographic Details
Date:2010
Main Authors: V. I. Gavrysh, D. V. Fedasyuk
Format: Article
Language:English
Published: 2010
Series:Semiconductor Physics, Quantum Electronics and Optoelectronics
Online Access:http://jnas.nbuv.gov.ua/article/UJRN-0000349393
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Journal Title:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
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author V. I. Gavrysh
D. V. Fedasyuk
author_facet V. I. Gavrysh
D. V. Fedasyuk
author_sort V. I. Gavrysh
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institution Library portal of National Academy of Sciences of Ukraine | LibNAS
language English
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series Semiconductor Physics, Quantum Electronics and Optoelectronics
spelling open-sciencenbuvgovua-1001222024-04-17T17:55:31Z Thermal simulation of heterogeneous structural components in microelectronic devices V. I. Gavrysh D. V. Fedasyuk 1560-8034 2010 en Semiconductor Physics, Quantum Electronics and Optoelectronics http://jnas.nbuv.gov.ua/article/UJRN-0000349393 Article
spellingShingle Semiconductor Physics, Quantum Electronics and Optoelectronics
V. I. Gavrysh
D. V. Fedasyuk
Thermal simulation of heterogeneous structural components in microelectronic devices
title Thermal simulation of heterogeneous structural components in microelectronic devices
title_full Thermal simulation of heterogeneous structural components in microelectronic devices
title_fullStr Thermal simulation of heterogeneous structural components in microelectronic devices
title_full_unstemmed Thermal simulation of heterogeneous structural components in microelectronic devices
title_short Thermal simulation of heterogeneous structural components in microelectronic devices
title_sort thermal simulation of heterogeneous structural components in microelectronic devices
url http://jnas.nbuv.gov.ua/article/UJRN-0000349393
work_keys_str_mv AT vigavrysh thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices
AT dvfedasyuk thermalsimulationofheterogeneousstructuralcomponentsinmicroelectronicdevices