APA (7th ed.) Citation

Kuskov, J. M., Kuzmenko, O. G., & Lentjugov, I. P. (2019). Application of chips in electroslag surfacing of dies in current-conducting mold.

Chicago Style (17th ed.) Citation

Kuskov, Ju. M., O. G. Kuzmenko, and I. P. Lentjugov. Application of Chips in Electroslag Surfacing of Dies in Current-conducting Mold. 2019.

MLA (8th ed.) Citation

Kuskov, Ju. M., et al. Application of Chips in Electroslag Surfacing of Dies in Current-conducting Mold. 2019.

Warning: These citations may not always be 100% accurate.