Technology options for embedding low-profile electronic components in printed circuit boards

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Bibliographic Details
Date:2018
Main Authors: A. A. Efimenko, V. O. Ryabov
Format: Article
Language:English
Published: 2018
Series:Technology and design in electronic equipment
Online Access:http://jnas.nbuv.gov.ua/article/UJRN-0000858862
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Journal Title:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
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author A. A. Efimenko
V. O. Ryabov
author_facet A. A. Efimenko
V. O. Ryabov
author_sort A. A. Efimenko
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institution Library portal of National Academy of Sciences of Ukraine | LibNAS
language English
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publishDate 2018
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series Technology and design in electronic equipment
spelling open-sciencenbuvgovua-261912024-02-27T21:43:42Z Technology options for embedding low-profile electronic components in printed circuit boards A. A. Efimenko V. O. Ryabov 2225-5818 2018 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000858862 Article
spellingShingle Technology and design in electronic equipment
A. A. Efimenko
V. O. Ryabov
Technology options for embedding low-profile electronic components in printed circuit boards
title Technology options for embedding low-profile electronic components in printed circuit boards
title_full Technology options for embedding low-profile electronic components in printed circuit boards
title_fullStr Technology options for embedding low-profile electronic components in printed circuit boards
title_full_unstemmed Technology options for embedding low-profile electronic components in printed circuit boards
title_short Technology options for embedding low-profile electronic components in printed circuit boards
title_sort technology options for embedding low-profile electronic components in printed circuit boards
url http://jnas.nbuv.gov.ua/article/UJRN-0000858862
work_keys_str_mv AT aaefimenko technologyoptionsforembeddinglowprofileelectroniccomponentsinprintedcircuitboards
AT voryabov technologyoptionsforembeddinglowprofileelectroniccomponentsinprintedcircuitboards