Efimenko, A. A., & Paljukh, B. P. (2017). Models of printed boards for solderless mounting of electronic components by foil perforation method.
Chicago Style (17th ed.) CitationEfimenko, A. A., and B. P. Paljukh. Models of Printed Boards for Solderless Mounting of Electronic Components by Foil Perforation Method. 2017.
MLA (8th ed.) CitationEfimenko, A. A., and B. P. Paljukh. Models of Printed Boards for Solderless Mounting of Electronic Components by Foil Perforation Method. 2017.
Warning: These citations may not always be 100% accurate.