Models of printed boards for solderless mounting of electronic components by foil perforation method

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Бібліографічні деталі
Дата:2017
Автори: A. A. Efimenko, B. P. Paljukh
Формат: Стаття
Мова:English
Опубліковано: 2017
Назва видання:Technology and design in electronic equipment
Онлайн доступ:http://jnas.nbuv.gov.ua/article/UJRN-0000798642
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Library portal of National Academy of Sciences of Ukraine | LibNAS
id open-sciencenbuvgovua-39255
record_format dspace
spelling open-sciencenbuvgovua-392552024-02-29T11:45:12Z Models of printed boards for solderless mounting of electronic components by foil perforation method A. A. Efimenko B. P. Paljukh 2225-5818 2017 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000798642 Article
institution Library portal of National Academy of Sciences of Ukraine | LibNAS
collection Open-Science
language English
series Technology and design in electronic equipment
spellingShingle Technology and design in electronic equipment
A. A. Efimenko
B. P. Paljukh
Models of printed boards for solderless mounting of electronic components by foil perforation method
format Article
author A. A. Efimenko
B. P. Paljukh
author_facet A. A. Efimenko
B. P. Paljukh
author_sort A. A. Efimenko
title Models of printed boards for solderless mounting of electronic components by foil perforation method
title_short Models of printed boards for solderless mounting of electronic components by foil perforation method
title_full Models of printed boards for solderless mounting of electronic components by foil perforation method
title_fullStr Models of printed boards for solderless mounting of electronic components by foil perforation method
title_full_unstemmed Models of printed boards for solderless mounting of electronic components by foil perforation method
title_sort models of printed boards for solderless mounting of electronic components by foil perforation method
publishDate 2017
url http://jnas.nbuv.gov.ua/article/UJRN-0000798642
work_keys_str_mv AT aaefimenko modelsofprintedboardsforsolderlessmountingofelectroniccomponentsbyfoilperforationmethod
AT bppaljukh modelsofprintedboardsforsolderlessmountingofelectroniccomponentsbyfoilperforationmethod
first_indexed 2024-03-30T09:14:57Z
last_indexed 2024-03-30T09:14:57Z
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