Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field

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Бібліографічні деталі
Дата:2017
Автори: V. V. Gladkovskij, O. A. Fedorovich
Формат: Стаття
Мова:English
Опубліковано: 2017
Назва видання:Technology and design in electronic equipment
Онлайн доступ:http://jnas.nbuv.gov.ua/article/UJRN-0000798647
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Назва журналу:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
id open-sciencenbuvgovua-39260
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spelling open-sciencenbuvgovua-392602024-02-29T11:45:12Z Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field V. V. Gladkovskij O. A. Fedorovich 2225-5818 2017 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000798647 Article
institution Library portal of National Academy of Sciences of Ukraine | LibNAS
collection Open-Science
language English
series Technology and design in electronic equipment
spellingShingle Technology and design in electronic equipment
V. V. Gladkovskij
O. A. Fedorovich
Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
format Article
author V. V. Gladkovskij
O. A. Fedorovich
author_facet V. V. Gladkovskij
O. A. Fedorovich
author_sort V. V. Gladkovskij
title Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_short Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_full Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_fullStr Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_full_unstemmed Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_sort investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
publishDate 2017
url http://jnas.nbuv.gov.ua/article/UJRN-0000798647
work_keys_str_mv AT vvgladkovskij investigationoftheinfluenceofoxygenontherateandanisotropyofdeepetchingofsiliconintheplasmachemicalreactorwiththecontrolledmagneticfield
AT oafedorovich investigationoftheinfluenceofoxygenontherateandanisotropyofdeepetchingofsiliconintheplasmachemicalreactorwiththecontrolledmagneticfield
first_indexed 2024-03-30T09:14:59Z
last_indexed 2024-03-30T09:14:59Z
_version_ 1796881368516395008