Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field

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Datum:2017
Hauptverfasser: V. V. Gladkovskij, O. A. Fedorovich
Format: Artikel
Sprache:Englisch
Veröffentlicht: 2017
Schriftenreihe:Technology and design in electronic equipment
Online Zugang:http://jnas.nbuv.gov.ua/article/UJRN-0000798647
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Назва журналу:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
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author V. V. Gladkovskij
O. A. Fedorovich
author_facet V. V. Gladkovskij
O. A. Fedorovich
author_sort V. V. Gladkovskij
collection Open-Science
first_indexed 2025-07-17T19:15:58Z
format Article
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institution Library portal of National Academy of Sciences of Ukraine | LibNAS
language English
last_indexed 2025-07-17T19:15:58Z
publishDate 2017
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series Technology and design in electronic equipment
spelling open-sciencenbuvgovua-392602024-02-29T11:45:12Z Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field V. V. Gladkovskij O. A. Fedorovich 2225-5818 2017 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000798647 Article
spellingShingle Technology and design in electronic equipment
V. V. Gladkovskij
O. A. Fedorovich
Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_full Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_fullStr Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_full_unstemmed Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_short Investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
title_sort investigation of the influence of oxygen on the rate and anisotropy of deep etching of silicon in the plasma-chemical reactor with the controlled magnetic field
url http://jnas.nbuv.gov.ua/article/UJRN-0000798647
work_keys_str_mv AT vvgladkovskij investigationoftheinfluenceofoxygenontherateandanisotropyofdeepetchingofsiliconintheplasmachemicalreactorwiththecontrolledmagneticfield
AT oafedorovich investigationoftheinfluenceofoxygenontherateandanisotropyofdeepetchingofsiliconintheplasmachemicalreactorwiththecontrolledmagneticfield