Investigation of temperature fields in a thermosensitive layer with a through inclusion
Saved in:
| Date: | 2016 |
|---|---|
| Main Author: | V. I. Havrysh |
| Format: | Article |
| Language: | English |
| Published: |
2016
|
| Series: | Materials Science (Physicochemical mechanics of materials) |
| Online Access: | http://jnas.nbuv.gov.ua/article/UJRN-0000664820 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Journal Title: | Library portal of National Academy of Sciences of Ukraine | LibNAS |
Institution
Library portal of National Academy of Sciences of Ukraine | LibNASSimilar Items
-
Investigation of temperature fields in microelectronic devices of layered structure with through inclusions
by: V. I. Gavrysh, et al.
Published: (2017) -
Thermal state modeling in thermosensitive elements of microelectronic devices with reach-through foreign inclusions
by: V. I. Gavrysh
Published: (2012) -
Thermal state modeling in thermosensitive elements of microelectronic devices with reach-through foreign inclusions
by: Gavrysh, V.I.
Published: (2012) -
Nonlinear boundary value problem of heat conduction for a layered plate with inclusion
by: V. I. Havrysh
Published: (2015) -
A boundary-value problem for a piece-wise layer with foreign inclusions
by: V. I. Havrysh, et al.
Published: (2011)