Pashchenko, G. A., Kravetskyi, Y., & Fomin, A. V. (2015). Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing.
Chicago-Zitierstil (17. Ausg.)Pashchenko, G. A., Yu Kravetskyi, und A. V. Fomin. Modeling the Process of Removal Aimed at Cut Traces on Semiconductor Wafers by Using the Method of Contactless Chemical-and-dynamical Polishing. 2015.
MLA-Zitierstil (8. Ausg.)Pashchenko, G. A., et al. Modeling the Process of Removal Aimed at Cut Traces on Semiconductor Wafers by Using the Method of Contactless Chemical-and-dynamical Polishing. 2015.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.