APA (7th ed.) Citation

Pashchenko, G. A., Kravetskyi, Y., & Fomin, A. V. (2015). Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing.

Chicago Style (17th ed.) Citation

Pashchenko, G. A., Yu Kravetskyi, and A. V. Fomin. Modeling the Process of Removal Aimed at Cut Traces on Semiconductor Wafers by Using the Method of Contactless Chemical-and-dynamical Polishing. 2015.

MLA (8th ed.) Citation

Pashchenko, G. A., et al. Modeling the Process of Removal Aimed at Cut Traces on Semiconductor Wafers by Using the Method of Contactless Chemical-and-dynamical Polishing. 2015.

Warning: These citations may not always be 100% accurate.