Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
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| Datum: | 2015 |
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| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | Englisch |
| Veröffentlicht: |
2015
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| Schriftenreihe: | Semiconductor Physics, Quantum Electronics and Optoelectronics |
| Online Zugang: | http://jnas.nbuv.gov.ua/article/UJRN-0000714283 |
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| Назва журналу: | Library portal of National Academy of Sciences of Ukraine | LibNAS |
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Library portal of National Academy of Sciences of Ukraine | LibNAS| _version_ | 1859526018576941056 |
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| author | G. A. Pashchenko Yu. Kravetskyi A. V. Fomin |
| author_facet | G. A. Pashchenko Yu. Kravetskyi A. V. Fomin |
| author_sort | G. A. Pashchenko |
| collection | Open-Science |
| first_indexed | 2025-07-22T05:03:31Z |
| format | Article |
| id | open-sciencenbuvgovua-65605 |
| institution | Library portal of National Academy of Sciences of Ukraine | LibNAS |
| language | English |
| last_indexed | 2025-07-22T05:03:31Z |
| publishDate | 2015 |
| record_format | dspace |
| series | Semiconductor Physics, Quantum Electronics and Optoelectronics |
| spelling | open-sciencenbuvgovua-656052024-04-16T13:19:01Z Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing G. A. Pashchenko Yu. Kravetskyi A. V. Fomin 1560-8034 2015 en Semiconductor Physics, Quantum Electronics and Optoelectronics http://jnas.nbuv.gov.ua/article/UJRN-0000714283 Article |
| spellingShingle | Semiconductor Physics, Quantum Electronics and Optoelectronics G. A. Pashchenko Yu. Kravetskyi A. V. Fomin Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing |
| title | Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing |
| title_full | Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing |
| title_fullStr | Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing |
| title_full_unstemmed | Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing |
| title_short | Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing |
| title_sort | modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing |
| url | http://jnas.nbuv.gov.ua/article/UJRN-0000714283 |
| work_keys_str_mv | AT gapashchenko modelingtheprocessofremovalaimedatcuttracesonsemiconductorwafersbyusingthemethodofcontactlesschemicalanddynamicalpolishing AT yukravetskyi modelingtheprocessofremovalaimedatcuttracesonsemiconductorwafersbyusingthemethodofcontactlesschemicalanddynamicalpolishing AT avfomin modelingtheprocessofremovalaimedatcuttracesonsemiconductorwafersbyusingthemethodofcontactlesschemicalanddynamicalpolishing |