Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing

Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing

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Bibliographic Details
Date:2015
Main Authors: G. A. Pashchenko, Yu. Kravetskyi, A. V. Fomin
Format: Article
Language:English
Published: 2015
Series:Semiconductor Physics, Quantum Electronics and Optoelectronics
Online Access:http://jnas.nbuv.gov.ua/article/UJRN-0000714283
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Journal Title:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
id open-sciencenbuvgovua-65605
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spelling open-sciencenbuvgovua-656052024-04-16T13:19:01Z Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing G. A. Pashchenko Yu. Kravetskyi A. V. Fomin 1560-8034 2015 en Semiconductor Physics, Quantum Electronics and Optoelectronics http://jnas.nbuv.gov.ua/article/UJRN-0000714283 Article
institution Library portal of National Academy of Sciences of Ukraine | LibNAS
collection Open-Science
language English
series Semiconductor Physics, Quantum Electronics and Optoelectronics
spellingShingle Semiconductor Physics, Quantum Electronics and Optoelectronics
G. A. Pashchenko
Yu. Kravetskyi
A. V. Fomin
Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
format Article
author G. A. Pashchenko
Yu. Kravetskyi
A. V. Fomin
author_facet G. A. Pashchenko
Yu. Kravetskyi
A. V. Fomin
author_sort G. A. Pashchenko
title Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
title_short Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
title_full Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
title_fullStr Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
title_full_unstemmed Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
title_sort modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
publishDate 2015
url http://jnas.nbuv.gov.ua/article/UJRN-0000714283
work_keys_str_mv AT gapashchenko modelingtheprocessofremovalaimedatcuttracesonsemiconductorwafersbyusingthemethodofcontactlesschemicalanddynamicalpolishing
AT yukravetskyi modelingtheprocessofremovalaimedatcuttracesonsemiconductorwafersbyusingthemethodofcontactlesschemicalanddynamicalpolishing
AT avfomin modelingtheprocessofremovalaimedatcuttracesonsemiconductorwafersbyusingthemethodofcontactlesschemicalanddynamicalpolishing
first_indexed 2025-07-22T05:03:31Z
last_indexed 2025-07-22T05:03:31Z
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