Modeling the process of removal aimed at cut traces on semiconductor wafers by using the method of contactless chemical-and-dynamical polishing
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| Date: | 2015 |
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| Main Authors: | , , |
| Format: | Article |
| Language: | English |
| Published: |
2015
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| Series: | Semiconductor Physics, Quantum Electronics and Optoelectronics |
| Online Access: | http://jnas.nbuv.gov.ua/article/UJRN-0000714283 |
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| Journal Title: | Library portal of National Academy of Sciences of Ukraine | LibNAS |