Development of deep silicon plasma etching for 3D integration technology

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Бібліографічні деталі
Дата:2014
Автори: A. A. Golishnikov, M. G. Putrja
Формат: Стаття
Мова:English
Опубліковано: 2014
Назва видання:Technology and design in electronic equipment
Онлайн доступ:http://jnas.nbuv.gov.ua/article/UJRN-0000405244
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Назва журналу:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
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spelling open-sciencenbuvgovua-738132024-04-16T17:15:37Z Development of deep silicon plasma etching for 3D integration technology A. A. Golishnikov M. G. Putrja 2225-5818 2014 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000405244 Article
institution Library portal of National Academy of Sciences of Ukraine | LibNAS
collection Open-Science
language English
series Technology and design in electronic equipment
spellingShingle Technology and design in electronic equipment
A. A. Golishnikov
M. G. Putrja
Development of deep silicon plasma etching for 3D integration technology
format Article
author A. A. Golishnikov
M. G. Putrja
author_facet A. A. Golishnikov
M. G. Putrja
author_sort A. A. Golishnikov
title Development of deep silicon plasma etching for 3D integration technology
title_short Development of deep silicon plasma etching for 3D integration technology
title_full Development of deep silicon plasma etching for 3D integration technology
title_fullStr Development of deep silicon plasma etching for 3D integration technology
title_full_unstemmed Development of deep silicon plasma etching for 3D integration technology
title_sort development of deep silicon plasma etching for 3d integration technology
publishDate 2014
url http://jnas.nbuv.gov.ua/article/UJRN-0000405244
work_keys_str_mv AT aagolishnikov developmentofdeepsiliconplasmaetchingfor3dintegrationtechnology
AT mgputrja developmentofdeepsiliconplasmaetchingfor3dintegrationtechnology
first_indexed 2024-04-17T05:18:59Z
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