Development of deep silicon plasma etching for 3D integration technology

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Datum:2014
Hauptverfasser: A. A. Golishnikov, M. G. Putrja
Format: Artikel
Sprache:Englisch
Veröffentlicht: 2014
Schriftenreihe:Technology and design in electronic equipment
Online Zugang:http://jnas.nbuv.gov.ua/article/UJRN-0000405244
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Назва журналу:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
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author A. A. Golishnikov
M. G. Putrja
author_facet A. A. Golishnikov
M. G. Putrja
author_sort A. A. Golishnikov
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institution Library portal of National Academy of Sciences of Ukraine | LibNAS
language English
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series Technology and design in electronic equipment
spelling open-sciencenbuvgovua-738132024-04-16T17:15:37Z Development of deep silicon plasma etching for 3D integration technology A. A. Golishnikov M. G. Putrja 2225-5818 2014 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000405244 Article
spellingShingle Technology and design in electronic equipment
A. A. Golishnikov
M. G. Putrja
Development of deep silicon plasma etching for 3D integration technology
title Development of deep silicon plasma etching for 3D integration technology
title_full Development of deep silicon plasma etching for 3D integration technology
title_fullStr Development of deep silicon plasma etching for 3D integration technology
title_full_unstemmed Development of deep silicon plasma etching for 3D integration technology
title_short Development of deep silicon plasma etching for 3D integration technology
title_sort development of deep silicon plasma etching for 3d integration technology
url http://jnas.nbuv.gov.ua/article/UJRN-0000405244
work_keys_str_mv AT aagolishnikov developmentofdeepsiliconplasmaetchingfor3dintegrationtechnology
AT mgputrja developmentofdeepsiliconplasmaetchingfor3dintegrationtechnology