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Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits

Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits

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Bibliographic Details
Main Authors: V. L. Lanin, I. B. Petukhov
Format: Article
Language:English
Published: 2014
Series:Technology and design in electronic equipment
Online Access:http://jnas.nbuv.gov.ua/article/UJRN-0000405258
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id open-sciencenbuvgovua-73826
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spelling open-sciencenbuvgovua-738262024-04-16T17:15:41Z Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits V. L. Lanin I. B. Petukhov 2225-5818 2014 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000405258 Article
institution Library portal of National Academy of Sciences of Ukraine | LibNAS
collection Open-Science
language English
series Technology and design in electronic equipment
spellingShingle Technology and design in electronic equipment
V. L. Lanin
I. B. Petukhov
Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
format Article
author V. L. Lanin
I. B. Petukhov
author_facet V. L. Lanin
I. B. Petukhov
author_sort V. L. Lanin
title Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_short Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_full Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_fullStr Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_full_unstemmed Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_sort obtaining raised density connections by thermosonic microwelding in 3d integrated microcircuits
publishDate 2014
url http://jnas.nbuv.gov.ua/article/UJRN-0000405258
work_keys_str_mv AT vllanin obtainingraiseddensityconnectionsbythermosonicmicroweldingin3dintegratedmicrocircuits
AT ibpetukhov obtainingraiseddensityconnectionsbythermosonicmicroweldingin3dintegratedmicrocircuits
first_indexed 2024-04-17T05:19:03Z
last_indexed 2024-04-17T05:19:03Z
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