Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits

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Datum:2014
Hauptverfasser: V. L. Lanin, I. B. Petukhov
Format: Artikel
Sprache:Englisch
Veröffentlicht: 2014
Schriftenreihe:Technology and design in electronic equipment
Online Zugang:http://jnas.nbuv.gov.ua/article/UJRN-0000405258
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Назва журналу:Library portal of National Academy of Sciences of Ukraine | LibNAS

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Library portal of National Academy of Sciences of Ukraine | LibNAS
_version_ 1859530579399147520
author V. L. Lanin
I. B. Petukhov
author_facet V. L. Lanin
I. B. Petukhov
author_sort V. L. Lanin
collection Open-Science
first_indexed 2025-07-22T07:20:38Z
format Article
id open-sciencenbuvgovua-73826
institution Library portal of National Academy of Sciences of Ukraine | LibNAS
language English
last_indexed 2025-07-22T07:20:38Z
publishDate 2014
record_format dspace
series Technology and design in electronic equipment
spelling open-sciencenbuvgovua-738262024-04-16T17:15:41Z Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits V. L. Lanin I. B. Petukhov 2225-5818 2014 en Technology and design in electronic equipment http://jnas.nbuv.gov.ua/article/UJRN-0000405258 Article
spellingShingle Technology and design in electronic equipment
V. L. Lanin
I. B. Petukhov
Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_full Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_fullStr Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_full_unstemmed Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_short Obtaining raised density connections by thermosonic microwelding in 3D integrated microcircuits
title_sort obtaining raised density connections by thermosonic microwelding in 3d integrated microcircuits
url http://jnas.nbuv.gov.ua/article/UJRN-0000405258
work_keys_str_mv AT vllanin obtainingraiseddensityconnectionsbythermosonicmicroweldingin3dintegratedmicrocircuits
AT ibpetukhov obtainingraiseddensityconnectionsbythermosonicmicroweldingin3dintegratedmicrocircuits